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    3D IC Stacking Technology

    By: Ajay Kumar, Sesh Ramaswami

    Date Released

    Out of Print

    The latest advances in three-dimensional integrated circuit stacking technology

    With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

    3D IC Stacking Technology covers:

    High density through silicon stacking (TSS) technology

    Practical design ecosystem for heterogeneous 3D IC products

    Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack

    Process integration for TSV manufacturing

    High-aspect-ratio silicon etch for TSV

    Dielectric deposition for TSV

    Barrier and seed deposition

    Copper electrodeposition for TSV

    Chemical mechanical polishing for TSV applications

    Temporary and permanent bonding

    Assembly and test aspects of TSV technology

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