Area Array Packaging Handbook: Manufacturing and Assembly

Area Array Packaging Handbook: Manufacturing and Assembly by Ken Gilleo
QTY
-+
$189.99
 
 


ISBN
9780071500654
Date Released
Binding
eBook
 
 

Instant Download

Other Titles by Ken Gilleo

Description
Information
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
ISBN:
9780071500654
Publication Date:
26 / 11 / 2001

You might also like