Microvias: For Low Cost, High Density Interconnects

By: Ricky Lee

QTY
-+
$187.99
 
 
ISBN
9780071382991
Date Released
Binding
eBook
 
 

Instant Download

Description
Information
State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.
ISBN:
9780071382991
Publication Date:
21 / 05 / 2001

You might also like