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    Reliability of RoHS-Compliant 2D and 3D IC Interconnects

    By: John H. Lau

    Date Released

    Out of Print

    Proven 2D and 3D IC lead-free interconnect reliability techniques

    Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

    Covers reliability of:

    2D and 3D IC lead-free interconnects

    CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints

    Lead-free (SACX) solder joints

    Low-temperature lead-free (SnBiAg) solder joints

    Solder joints with voids, high strain rate, and high ramp rate

    VCSEL and LED lead-free interconnects

    3D LED and 3D MEMS with TSVs

    Chip-to-wafer (C2W) bonding and lead-free interconnects

    Wafer-to-wafer (W2W) bonding and lead-free interconnects

    3D IC chip stacking with low-temperature bonding

    TSV interposers and lead-free interconnects

    Electromigration of lead-free microbumps for 3D IC integration

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