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    By: Rao Tummala

    QTY
    -+
    $195.00
     
     
    ISBN
    9780071459068
    Date Released
    Binding
    Hardcover
    Pages
    512
     

    Only available to order
    Estimated 10 - 14 business days until dispatch

    If ordered before the 14th of December, this product should arrive by Christmas unless it is going to regional Australia
    Description
    System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keeping a full system with computing, communications, and consumer functions all in a single chip.

    Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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