System on Package by Rao Tummala

By: Rao Tummala

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$195.00
 
 
ISBN
9780071459068
Date Released
Binding
Hardcover
Pages
512
 

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Description
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keeping a full system with computing, communications, and consumer functions all in a single chip.

Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
ISBN:
9780071459068
Publication Date:
01 / 06 / 2007
Pages:
512

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