Through-Silicon Vias (TSVS) for 3D Integration

Through-Silicon Vias (TSVS) for 3D Integration by John H. Lau
QTY
-+
$361.99
 
 


ISBN
9780071785143
Date Released
Binding
Hardcover
Pages
480
Dimensions
159 x 235 x 20mm

Only available to order
Estimated 10 - 14 business days until dispatch

If ordered before the 14th of December, this product should arrive by Christmas unless it is going to regional Australia

Other Titles by John H. Lau

Description
Information
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
ISBN:
9780071785143
Publication Date:
20 / 09 / 2012
Pages:
480
Dimensions:
159 x 235 x 20mm

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