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    Through-Silicon Vias (TSVS) for 3D Integration

    By: John H. Lau

    QTY
    -+
    $361.99
     
     
    ISBN
    9780071785143
    Date Released
    Binding
    Hardcover
    Pages
    480
     

    Only available to order
    Estimated 10 - 14 business days until dispatch

    If ordered before the 14th of December, this product should arrive by Christmas unless it is going to regional Australia
    Description
    This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.

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