Through-Silicon Vias (TSVS) for 3D Integration

Through-Silicon Vias (TSVS) for 3D Integration by John H. Lau

By: John H. Lau

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$361.99
 
 
ISBN
9780071785143
Date Released
Binding
Hardcover
Pages
480
Dimensions
159 x 235 x 20mm

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Description
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This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
ISBN:
9780071785143
Publication Date:
20 / 09 / 2012
Pages:
480
Dimensions:
159 x 235 x 20mm

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