Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:

Autonomous, Hybrid, and Electric Vehicles
Energy Conversion and Storage
Flexible and Wearable Electronics
Heterogeneous Integration
Internet of Things
Photonics and Optics
Power Electronics
Servers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions and
Service to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Cooling
of Server Systems